Pure copper layer formation on pure copper substrate using multi-beam laser cladding system with blue diode lasers
Crossref DOI link: https://doi.org/10.1007/s00339-020-03559-6
Published Online: 2020-05-14
Published Print: 2020-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hara, Takahiro
Sato, Yuji
Higashino, Ritsuko
Funada, Yoshinori
Ohkubo, Tomomasa
Morimoto, Kento
Abe, Nobuyuki
Tsukamoto, Masahiro
Text and Data Mining valid from 2020-05-14
Version of Record valid from 2020-05-14
Article History
Received: 15 October 2019
Accepted: 16 April 2020
First Online: 14 May 2020