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Process mechanism of ultrafast laser multi-focal-scribing for ultrafine and efficient stealth dicing of SiC wafers

Crossref DOI link: https://doi.org/10.1007/s00339-022-06012-y

Published Online: 2022-09-10

Published Print: 2022-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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