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Thermal annealing effect on phase evolution, physical properties of DC sputtered copper oxide thin films and transport behavior of ITO/CuO/Al Schottky diodes

Crossref DOI link: https://doi.org/10.1007/s00339-024-07464-0

Published Online: 2024-04-16

Published Print: 2024-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Jagadish, K. A.

Kekuda, Dhananjaya https://orcid.org/0000-0003-4041-0138
Funding

Funding for this research was provided by:

Manipal Academy of Higher Education, Manipal
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Article History

Received: 17 January 2024

Accepted: 18 March 2024

First Online: 16 April 2024

Declarations

:

: The authors verify that they have no disclosed financial or personal conflicts that could have impacted the research described in this study.

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