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A lattice fraction stress model with consideration of thermal activation

Published Online: 2024-10-05

Published Print: 2024-11

Authors

Sun, Guangpeng

Tian, Feng

Du, Juan

Wen, Bin https://orcid.org/0000-0001-9846-5452
Funding

Funding for this research was provided by:

Innovative Research Group Project of the National Natural Science Foundation of China (U23A20537, 51925105)
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Text and Data Mining valid from 2024-10-05

Version of Record valid from 2024-10-05
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Article History

Received: 29 June 2024

Accepted: 28 September 2024

First Online: 5 October 2024

Declarations

:

: The authors declare that they have no conflicts of interest.

: Not Applicable.

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