Characterizations and development of Sn-6.5Zn-0.5Cu-0.2Ni lead-free solder doped with titanium oxide and zirconium oxide nanoparticles for microelectronic applications
Crossref DOI link: https://doi.org/10.1007/s00339-025-08332-1
Published Online: 2025-03-26
Published Print: 2025-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mohamed, H. S.
Mahmoud, M. A.
Mousa, M. M. https://orcid.org/0000-0001-9814-179X
Text and Data Mining valid from 2025-03-26
Version of Record valid from 2025-03-26
Article History
Received: 7 December 2024
Accepted: 6 February 2025
First Online: 26 March 2025
Declarations
:
: The authors declare that they have no conflicts of interest/Competing Interests.