On treatment of ultra-low-k SiCOH in CF4 plasmas: correlation between the concentration of etching products and etching rate
Crossref DOI link: https://doi.org/10.1007/s00340-015-6063-7
Published Online: 2015-03-07
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lang, N.
Zimmermann, S.
Zimmermann, H.
Macherius, U.
Uhlig, B.
Schaller, M.
Schulz, S. E.
Röpcke, J.
Text and Data Mining valid from 2015-03-07