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Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features

Published Online: 2025-10-22

Published Print: 2025-12

Authors

Gong, Yanpeng https://orcid.org/0000-0002-3177-2826
Li, Sishuai

Qin, Fei

Xu, Bingbing
Funding

Funding for this research was provided by:

Gottfried Wilhelm Leibniz Universität Hannover
License Information

Text and Data Mining valid from 2025-10-22

Version of Record valid from 2025-10-22
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Article History

Received: 21 May 2025

Accepted: 24 September 2025

First Online: 22 October 2025

Declarations

:

: The authors declare no conflict of interest.

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