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Authors
Hu, Jianwei
Liu, Ruixin
Chen, Zhonghui
Wang, Dengzhun
Zhang, Yongjun
Xie, Benliang
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Funding
Funding for this research was provided by:
National Natural Science Foundation of China (61562009)
Guizhou University Introduced Talent Research Project (2015-29)
Open Fund Project in Semiconductor Power Device Reliability Engineering Center of Ministry of Education (ERCMEKFJJ2019-(06))
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Article History
Accepted: 23 January 2022
First Online: 6 March 2022
Declarations
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: The authors declare that they have no conflict of interest.
: This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit <u>.</u>
