A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions
Crossref DOI link: https://doi.org/10.1007/s00466-018-1590-9
Published Online: 2018-06-13
Published Print: 2019-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gong, Y. P.
Yang, H. S.
Dong, C. Y.
Text and Data Mining valid from 2018-06-13
Article History
Received: 22 January 2018
Accepted: 1 June 2018
First Online: 13 June 2018