Void-free BCB adhesive wafer bonding with high alignment accuracy
Crossref DOI link: https://doi.org/10.1007/s00542-014-2242-4
Published Online: 2014-06-25
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Song, Zhen
Tan, Zhimin
Liu, Litian
Wang, Zheyao
Text and Data Mining valid from 2014-06-25