The fabrication of back etching 3C-SiC-on-Si diaphragm employing KOH + IPA in MEMS capacitive pressure sensor
Crossref DOI link: https://doi.org/10.1007/s00542-014-2267-8
Published Online: 2014-08-05
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Marsi, Noraini
Majlis, Burhanuddin Yeop
Mohd-Yasin, Faisal
Hamzah, Azrul Azlan
Text and Data Mining valid from 2014-08-05