Fabrication challenges and test structures for high-aspect-ratio SOI MEMS devices with refilled electrical isolation trenches
Crossref DOI link: https://doi.org/10.1007/s00542-014-2357-7
Published Online: 2014-12-11
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xie, Jin
Text and Data Mining valid from 2014-12-11