High frequency characterization and analysis of through silicon vias and coplanar waveguides for silicon interposer
Crossref DOI link: https://doi.org/10.1007/s00542-014-2390-6
Published Online: 2014-12-28
Published Print: 2016-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Huijuan
Ren, Xiaoli
Zhou, Jing
Pang, Cheng
Song, Chongsheng
Dai, Fengwei
Xue, Kai
Jiang, Feng
Yu, Daquan
Wan, Lixi
Text and Data Mining valid from 2014-12-28