Low temperature wafer level conformal polymer dielectric spray coating for through silicon vias with 2:1 aspect ratio
Crossref DOI link: https://doi.org/10.1007/s00542-014-2400-8
Published Online: 2014-12-24
Published Print: 2016-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhuang, Yuechen
Yu, Daquan
Dai, Fengwei
Niu, Zhongcai
Text and Data Mining valid from 2014-12-24