UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding
Crossref DOI link: https://doi.org/10.1007/s00542-015-2432-8
Published Online: 2015-02-03
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Anantha, P.
Tan, C. S.
Text and Data Mining valid from 2015-02-03