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Wafer level vacuum packaging of micro-mirrors with buried signal lines

Crossref DOI link: https://doi.org/10.1007/s00542-015-2433-7

Published Online: 2015-02-01

Published Print: 2015-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Langa, S.

Drabe, C.

Herrmann, A.

Ludewig, T.

Rieck, A.

Flemming, A.

Kaden, C.
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