Kinetics of low temperature direct copper–copper bonding
Crossref DOI link: https://doi.org/10.1007/s00542-015-2436-4
Published Online: 2015-02-01
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gondcharton, P.
Imbert, B.
Benaissa, L.
Carron, V.
Verdier, M.
Text and Data Mining valid from 2015-02-01