Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films
Crossref DOI link: https://doi.org/10.1007/s00542-015-2437-3
Published Online: 2015-02-03
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Beche, E.
Fournel, F.
Larrey, V.
Rieutord, F.
Fillot, F.
Text and Data Mining valid from 2015-02-03