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Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Crossref DOI link: https://doi.org/10.1007/s00542-015-2449-z

Published Online: 2015-02-04

Published Print: 2016-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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