Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
Crossref DOI link: https://doi.org/10.1007/s00542-015-2577-5
Published Online: 2015-05-23
Published Print: 2016-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lucibello, A.
Capoccia, G.
Proietti, E.
Marcelli, R.
Margesin, B.
Mulloni, V.
Giacomozzi, F.
Vitulli, F.
Scipioni, M.
Bartolucci, G.
Text and Data Mining valid from 2015-05-23