Wafer level high-density trench capacitors by using a two-step trench-filling process
Crossref DOI link: https://doi.org/10.1007/s00542-015-2681-6
Published Online: 2015-09-23
Published Print: 2017-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zheng, Tao
Xu, Gaowei
Luo, Le
Text and Data Mining valid from 2015-09-23
