Crossmark

Fabrication and flow-sensor application of flexible thermal MEMS device based on Cu on polyimide substrate

Crossref DOI link: https://doi.org/10.1007/s00542-015-2704-3

Published Online: 2015-10-17

Published Print: 2017-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Shikida, Mitsuhiro

Niimi, Yosuke

Shibata, Shunji
Funding

Funding for this research was provided by:

Ministry of Education, Culture, Sports, Science, and Technology (26286034)

The Canon Foundation
License Information

Text and Data Mining valid from 2015-10-17