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High temperature investigation on a nickel–tin transient liquid-phase wafer bonding up to 600  $$^{\circ }$$ ∘ C

Crossref DOI link: https://doi.org/10.1007/s00542-015-2738-6

Published Online: 2015-12-12

Published Print: 2017-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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