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Low temperature solid–liquid interdiffusion wafer and die bonding based on PVD thin Sn/Cu films

Crossref DOI link: https://doi.org/10.1007/s00542-015-2784-0

Published Online: 2016-01-02

Published Print: 2017-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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