Transferring stress and temperature sensors for stress measurement of wafer level packaging
Crossref DOI link: https://doi.org/10.1007/s00542-016-2902-7
Published Online: 2016-03-14
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dou, Chuanguo
Yang, Heng http://orcid.org/0000-0002-8873-9576
Wu, Yanhong
Li, Xinxin
Text and Data Mining valid from 2016-03-14