Thermal annealing effects on the stress stability in silicon dioxide films grown by plasma-enhanced chemical vapor deposition
Crossref DOI link: https://doi.org/10.1007/s00542-016-3005-1
Published Online: 2016-06-02
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fu, Jianyu
Shang, Haiping
Li, Zhigang
Wang, Weibing
Chen, Dapeng
Funding for this research was provided by:
National Natural Science Foundation of China (61306141)
License valid from 2016-06-02