Design and simulation of a novel flip-chip structure for THz detector package
Crossref DOI link: https://doi.org/10.1007/s00542-016-3021-1
Published Online: 2016-06-23
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hao, Haidong http://orcid.org/0000-0001-9414-386X
Tang, Zhen
Lu, Hongda
Cheng, Lifeng
Lv, Xin
Funding for this research was provided by:
National Program on Key Basic Research Project of China (2010CB327505)
License valid from 2016-06-23