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Investigation of the anti-adhesion layers for nanoimprint molding

Crossref DOI link: https://doi.org/10.1007/s00542-016-3175-x

Published Online: 2016-10-20

Published Print: 2017-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Pan, C. T.

Yang, T. L.

Su, C. Y.

Chao, C. H.

Wang, Z. K.

Shen, S. C.
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License valid from 2016-10-20