Impact of polyimide liner on high-aspect-ratio through-silicon-vias (TSVs): electrical characteristics and copper protrusion
Crossref DOI link: https://doi.org/10.1007/s00542-016-3243-2
Published Online: 2017-01-04
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Shiwei
Yan, Yangyang
Cheng, Zhiqiang
Chen, Zhiming http://orcid.org/0000-0001-9195-1327
Ding, Yingtao
Funding for this research was provided by:
by the National Natural Science Foundation of China (61574016)
111 Project of China (B14010)
License valid from 2017-01-04