Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3:1 aspect ratio
Crossref DOI link: https://doi.org/10.1007/s00542-016-3267-7
Published Online: 2017-01-11
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xiao, Zhiyi
Yao, Mingjun
Yu, Daquan
Zhou, Minghao
Dai, Fengwei
Fan, Jun
Xiang, Min
Zhang, Wei
Funding for this research was provided by:
National Science and Technology Major Project (2014ZX02502)
License valid from 2017-01-11