Enhancement of vertical integration density by engineered BSOI wafers
Crossref DOI link: https://doi.org/10.1007/s00542-017-3522-6
Published Online: 2017-08-12
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kaden, C. http://orcid.org/0000-0001-7433-8950
Langa, S.
Ludewig, T.
Schönberger, A.
Herrmann, A.
Göbel, A.
Kolkovsky, V.
Jeroch, W.
Pufe, W.
Funding for this research was provided by:
Fraunhofer-Gesellschaft (826 332)
License valid from 2017-08-12