A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding
Crossref DOI link: https://doi.org/10.1007/s00542-017-3523-5
Published Online: 2017-08-29
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rebhan, B. http://orcid.org/0000-0001-7080-7000
Svoboda, J.
Panholzer, M.
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