Analyses and statistics of the electrical fail for flip chip packaging by using ANSYS simulation software and really underfill materials
Crossref DOI link: https://doi.org/10.1007/s00542-017-3605-4
Published Online: 2017-10-26
Published Print: 2018-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tsai, Shang-Te
Lin, Chi-Yu
Wu, Sung-Mao
Chang, Chung-Yao
Yang, Cheng-Fu
Text and Data Mining valid from 2017-10-26