A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
Crossref DOI link: https://doi.org/10.1007/s00542-018-4249-8
Published Online: 2018-12-05
Published Print: 2019-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Pengrong
Xie, Xiaochen
Wang, Yong
Lian, Binhao
Zhang, Guoqi
Funding for this research was provided by:
Beijing Natural Science Foundation (4172065)
Text and Data Mining valid from 2018-12-05
Article History
Received: 28 July 2018
Accepted: 29 November 2018
First Online: 5 December 2018