Design and application of a hybrid alignment platform for a double-sided hot embossing process
Crossref DOI link: https://doi.org/10.1007/s00542-019-04563-4
Published Online: 2019-07-26
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Cheng-Hsien http://orcid.org/0000-0003-3402-875X
Chiu, Cheng-Hao
Chen, Yu-Hsuan
Text and Data Mining valid from 2019-07-26
Version of Record valid from 2019-07-26
Article History
Received: 7 May 2019
Accepted: 20 July 2019
First Online: 26 July 2019