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Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface

Published Online: 2019-12-21

Published Print: 2020-06

Authors

Lin, Chao-Ming

Wu, Chia-Chin
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (106-2221-E-415-006)
License Information

Text and Data Mining valid from 2019-12-21

Version of Record valid from 2019-12-21
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Article History

Received: 18 October 2019

Accepted: 17 December 2019

First Online: 21 December 2019

Document is current