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The effects on residual stress in multilayer NTC thermistors during soldering process and bending test (I. soldering process)

Crossref DOI link: https://doi.org/10.1007/s00542-020-04855-0

Published Online: 2020-05-11

Published Print: 2020-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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