Investigation of the impact on the radio frequency (RF) behaviour of electrically conductive adhesives (ECAs) used in wafer-level packaging (WLP) of RF-MEMS
Crossref DOI link: https://doi.org/10.1007/s00542-020-04938-y
Published Online: 2020-06-20
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Iannacci, J. http://orcid.org/0000-0001-6462-4814
Text and Data Mining valid from 2020-06-20
Version of Record valid from 2020-06-20
Article History
Received: 30 March 2020
Accepted: 15 June 2020
First Online: 20 June 2020