Hot embossing of microfluidics in cyclic-olefin co-polymer using a wafer aligner-bonder
Crossref DOI link: https://doi.org/10.1007/s00542-020-05188-8
Published Online: 2021-01-05
Published Print: 2021-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Asif, Muhammad
Tait, R. Niall
Berini, Pierre http://orcid.org/0000-0002-6795-7275
Text and Data Mining valid from 2021-01-05
Version of Record valid from 2021-01-05
Article History
Received: 10 December 2020
Accepted: 12 December 2020
First Online: 5 January 2021