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Shear test evaluation of the mechanical reliability of micro bumps in semiconductors

Published Online: 2021-11-18

Published Print: 2022-10

Authors

Cho, Yeungjung

Hahn, Mibbeum

Jeong, Hyunsik

Jang, Gunhee https://orcid.org/0000-0002-4298-5675
Funding

Funding for this research was provided by:

Samsung (IO201221-08249-01)
License Information

Text and Data Mining valid from 2021-11-18

Version of Record valid from 2021-11-18
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Article History

Received: 27 September 2021

Accepted: 10 November 2021

First Online: 18 November 2021

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