Fabrication of high-aspect-ratio stepped Cu microcolumn array using UV-LIGA technology
Crossref DOI link: https://doi.org/10.1007/s00542-023-05491-0
Published Online: 2023-06-17
Published Print: 2023-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Du, Liqun http://orcid.org/0000-0003-0548-7797
Yuan, Bowen
Guo, Bingjiang
Wang, Shuai
Cai, Xiaoke
Funding for this research was provided by:
National Natural Science Foundation of China (51975103)
National Key R&D Program of China (2022YFB4601602)
Text and Data Mining valid from 2023-06-17
Version of Record valid from 2023-06-17
Article History
Received: 1 February 2023
Accepted: 6 June 2023
First Online: 17 June 2023