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Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration

Published Online: 2023-09-30

Published Print: 2023-11

Authors

Jeong, Hyunsik

Seo, Kwangwon

Bae, Jinsoo

Jang, Gunhee https://orcid.org/0000-0002-4298-5675
Funding

Funding for this research was provided by:

Samsung (IO201221-08249-01)
License Information

Text and Data Mining valid from 2023-09-30

Version of Record valid from 2023-09-30
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Article History

Received: 29 December 2022

Accepted: 15 September 2023

First Online: 30 September 2023

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