An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model
Crossref DOI link: https://doi.org/10.1007/s00707-015-1357-8
Published Online: 2015-05-03
Published Print: 2015-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gao, X.-L.
Su, Y.-Y.
Text and Data Mining valid from 2015-05-03
