Funding for this research was provided by:
National Natural Science Foundation of China (62104111, 12102192, 11772257, 61974073)
Natural Science Foundation of Jiangsu Higher Education Institutions of China (No. 19KJB510007)
the open research fund of the National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology
Article History
Received: 19 February 2022
Revised: 1 May 2022
Accepted: 12 May 2022
First Online: 22 June 2022