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A novel unified modeling of heat and moisture transport in a semiconductor containing spherical cavity

Crossref DOI link: https://doi.org/10.1007/s00707-025-04618-w

Published Online: 2026-01-23

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Mondal, Sudip https://orcid.org/0000-0001-8496-1287
Sur, Abhik https://orcid.org/0000-0001-6326-6429
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Text and Data Mining valid from 2026-01-23

Version of Record valid from 2026-01-23
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Article History

Received: 17 June 2025

Revised: 19 November 2025

Accepted: 14 December 2025

First Online: 23 January 2026

Declarations

:

: The author declares that there is no conflict of interest.