Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential
Crossref DOI link: https://doi.org/10.1007/s00894-019-3939-1
Published Online: 2019-02-11
Published Print: 2019-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Motalab, M.
Paul, R.
Saha, S. http://orcid.org/0000-0003-0237-0200
Mojumder, S.
Ahmed, T.
Suhling, J. C.
Text and Data Mining valid from 2019-02-11
Article History
Received: 25 July 2018
Accepted: 24 January 2019
First Online: 11 February 2019