Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential
Crossref DOI link:
Update policy: https://doi.org/10.1007/SPRINGER_CROSSMARK_POLICY
Suhling, J. C.
Text and Data Mining valid from 2019-02-11
25 July 2018
24 January 2019
11 February 2019