Nanoscale friction behavior and deformation during copper chemical mechanical polishing process
Crossref DOI link: https://doi.org/10.1007/s00894-023-05699-x
Published Online: 2023-08-24
Published Print: 2023-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ngo, Thi-Thuy Binh
Nguyen, Van-Thuc
Fang, Te-Hua
Text and Data Mining valid from 2023-08-24
Version of Record valid from 2023-08-24
Article History
Received: 16 March 2023
Accepted: 17 August 2023
First Online: 24 August 2023
Declarations
:
: The authors declare no competing interests.