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Atomic-scale theoretical investigation into the role of metal passivation layers in lowering Cu-Cu bonding temperature

Published Online: 2025-08-06

Published Print: 2025-09

Authors

Dang, Haojie

Tian, Wenchao

Wang, Yongkun

Chen, Si

Xu, Hanyang
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Text and Data Mining valid from 2025-08-06

Version of Record valid from 2025-08-06
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Article History

Received: 21 April 2025

Accepted: 15 July 2025

First Online: 6 August 2025

Declarations

:

: The authors declare no competing interests.

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