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Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity

Crossref DOI link: https://doi.org/10.1007/s10118-018-2155-2

Published Online: 2018-06-12

Published Print: 2018-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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