Document is current

Any future updates will be listed below

Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion

Crossref DOI link: https://doi.org/10.1007/s10118-021-2524-0

Published Online: 2020-11-30

Published Print: 2021-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark